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[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - The development and application of ultra thin copper foil

✍ Scribed by Lie, Y. M.; Huang, C. C.; Tsao, P. Y.; Lira, S. C.; Chen, K. C.

Book ID: 126641692
Publisher: IEEE
Year: 2010
Weight: 56 KB
Category: Article
ISBN: 1424497833
DOI: 10.1109/IMPACT.2010.5699568

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