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[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Application of Excel and thermal network method to thermal analysis of electronic equipment

✍ Scribed by Tomimura, Toshio; Ishizuka, Masaru

Book ID: 125484508
Publisher: IEEE
Year: 2010
Weight: 344 KB
Category: Article
ISBN: 1424497833
DOI: 10.1109/IMPACT.2010.5699476

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