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[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Development of novel immersion gold for electroless nickel immersion gold process (ENIG) in PCB applications

✍ Scribed by Chan, C. M.; Tong, K. H.; Leung, S. L.; Wong, P. S.; Yee, K. W.; Bayes, M. W.

Book ID: 121791990
Publisher: IEEE
Year: 2010
Weight: 161 KB
Category: Article
ISBN: 1424497833
DOI: 10.1109/IMPACT.2010.5699468

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