✦ LIBER ✦

[IEEE 2009 IEEE International Test Conference (ITC) - Austin, TX, USA (2009.11.1-2009.11.6)] 2009 International Test Conference - Testing 3D chips containing through-silicon vias

✍ Scribed by Marinissen, Erik Jan; Zorian, Yervant

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 2009 IEEE International Test Confe

✍ Devadze, Sergei; Jutman, Artur; Aleksejev, Igor; Ubar, Raimund 📂 Article 📅 2009 🏛 IEEE ⚖ 227 KB

[IEEE 2009 IEEE International Test Confe

✍ Chakravadhanula, Krishna; Chickermane, Vivek; Keller, Brion; Gallagher, Patrick; 📂 Article 📅 2009 🏛 IEEE ⚖ 321 KB

[IEEE 2009 IEEE International Test Confe

✍ Mauroux, P.-D.; Virazel, A.; Bosio, A.; Dilillo, L.; Girard, P.; Pravossoudovitc 📂 Article 📅 2009 🏛 IEEE ⚖ 194 KB

[IEEE 2009 IEEE International Test Confe

✍ Petersen, Rex; Pant, Pankaj; Lopez, Pablo; Barton, Aaron; Ignowski, Jim; Josephs 📂 Article 📅 2009 🏛 IEEE ⚖ 799 KB

[IEEE 2009 IEEE International Test Confe

✍ Amyeen, M. Enamul; Venkataraman, Srikanth; Mak, Mun Wai 📂 Article 📅 2009 🏛 IEEE ⚖ 984 KB

[IEEE 2009 IEEE International Test Confe

✍ Mrugalski, G.; Mukherjee, N.; Rajski, J.; Czysz, D.; Tyszer, J. 📂 Article 📅 2009 🏛 IEEE ⚖ 760 KB