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[IEEE 2009 IEEE International Integrated Reliability Workshop (IRW) - South Lake Tahoe, CA, USA (2009.10.18-2009.10.22)] 2009 IEEE International Integrated Reliability Workshop Final Report - The helium ion microscope for interconnect material imaging

✍ Scribed by Thompson, William; Ogawa, Shinichi; Stern, Lewis; Scipioni, Larry; Notte, John

Book ID: 126757462
Publisher: IEEE
Year: 2009
Weight: 285 KB
Category: Article
ISBN: 1424439213
DOI: 10.1109/IRWS.2009.5383014

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