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[IEEE 2009 IEEE International Integrated Reliability Workshop (IRW) - South Lake Tahoe, CA, USA (2009.10.18-2009.10.22)] 2009 IEEE International Integrated Reliability Workshop Final Report - CU interconnect immortality criterion based on electromigration void growth saturation

✍ Scribed by Lamontagne, P.; Doyen, L.; Petitprez, E.; Ney, D.; Arnaud, L.; Waltz, P.; Wouters, Y.

Book ID: 126689129
Publisher: IEEE
Year: 2009
Weight: 475 KB
Category: Article
ISBN: 1424439213
DOI: 10.1109/IRWS.2009.5383034

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