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[IEEE 2008 International Interconnect Technology Conference - IITC - Burlingame, CA, USA (2008.06.1-2008.06.4)] 2008 International Interconnect Technology Conference - A 3D-IC Technology with Integrated Microchannel Cooling

โœ Scribed by Sekar, Deepak; King, Calvin; Dang, Bing; Spencer, Todd; Thacker, Hiren; Joseph, Paul; Bakir, Muhannad; Meindl, James


Book ID
125511478
Publisher
IEEE
Year
2008
Weight
523 KB
Category
Article
ISBN
1424419115

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