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[IEEE 2008 International Interconnect Technology Conference - IITC - Burlingame, CA, USA (2008.06.1-2008.06.4)] 2008 International Interconnect Technology Conference - Mechanistic Study of CO2 Plasma Damage to OSG Low k Dielectrics

โœ Scribed by Shi, H.; Bao, J.; Huang, H.; Chao, B.; Smith, S.; Sun, Y.; Ho, P. S.; Li, A.; Armacost, M.; Kyser, D.


Book ID
124168609
Publisher
IEEE
Year
2008
Weight
285 KB
Category
Article
ISBN
1424419115

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