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[IEEE 2008 Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Seoul, Korea (South) (2008.12.10-2008.12.12)] 2008 Electrical Design of Advanced Packaging and Systems Symposium - Impact of package inductance and DQ driver strength on the 3rd harmonic EMI from DRAM

✍ Scribed by Junho Lee, ; Dae-kun Yoon, ; Hyunseok Kim, ; Booho Jung, ; Hyungdong Lee, ; Kunwoo Park, ; Joongsik Kih,

Book ID: 126734240
Publisher: IEEE
Year: 2008
Weight: 638 KB
Category: Article
ISBN: 1424426332
DOI: 10.1109/EDAPS.2008.4736017

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