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[IEEE 2008 Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Seoul, Korea (South) (2008.12.10-2008.12.12)] 2008 Electrical Design of Advanced Packaging and Systems Symposium - Implementation of HF/UHF multiband RFID reader SiP with Package-on-Package technology

✍ Scribed by Kyeongil Yi, ; Hyunsik Kim, ; Jaewhan Kim, ; Jikon Kim, ; Cho, Junghyun; Kwangduk An, ; Shiho Kim,

Book ID: 118026105
Publisher: IEEE
Year: 2008
Weight: 1008 KB
Volume: 0
Category: Article
ISBN: 1424426332
DOI: 10.1109/edaps.2008.4736000

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