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[IEEE 2008 Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Seoul, Korea (South) (2008.12.10-2008.12.12)] 2008 Electrical Design of Advanced Packaging and Systems Symposium - Coupled high-speed interconnect analysis on parallel platforms

✍ Scribed by Paul, D.; Nakhla, N. M.; Achar, R.; Nakhla, M. S.

Book ID: 120817801
Publisher: IEEE
Year: 2008
Weight: 626 KB
Category: Article
ISBN: 1424426332
DOI: 10.1109/EDAPS.2008.4736035

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