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[IEEE 2008 Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Seoul, Korea (South) (2008.12.10-2008.12.12)] 2008 Electrical Design of Advanced Packaging and Systems Symposium - Analysis of the EMI and SI effects on the flexible-PCBs for mobile application

✍ Scribed by Tae-Heon Lee, ; Chang-Gyun Kim, ; Jang-Hoon Lee, ; Jae-Kyung Wee,

Book ID: 126616589
Publisher: IEEE
Year: 2008
Weight: 953 KB
Category: Article
ISBN: 1424426332
DOI: 10.1109/EDAPS.2008.4736008

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