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[IEEE 2008 Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Seoul, Korea (South) (2008.12.10-2008.12.12)] 2008 Electrical Design of Advanced Packaging and Systems Symposium - Quasi-static lumped element stand-alone package model for quad flat package

✍ Scribed by Paoletti, Umberto; Takashi Hisakado, ; Osami Wada,

Book ID: 125541264
Publisher: IEEE
Year: 2008
Weight: 699 KB
Category: Article
ISBN: 1424426332
DOI: 10.1109/EDAPS.2008.4735998

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