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[IEEE 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits - singapore (2008.07.7-2008.07.11)] 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Backside GMR Magnetic Microscopy for flip chip and related microelectronic devices

✍ Scribed by Hechtl, M.

Book ID: 125493965
Publisher: IEEE
Year: 2008
Weight: 423 KB
Category: Article
ISBN: 1424420393
DOI: 10.1109/IPFA.2008.4588181

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