𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits - singapore (2008.07.7-2008.07.11)] 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Trends in solar cell research

✍ Scribed by Mertens, R.

Book ID: 120637209
Publisher: IEEE
Year: 2008
Weight: 731 KB
Category: Article
ISBN: 1424420393
DOI: 10.1109/IPFA.2008.4588189

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 2008 15th International Symposium

[IEEE 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits - singapore (2008.07.7-2008.07.11)] 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Backside GMR Magnetic Microscopy for flip chip and related microelectronic devices

✍ Hechtl, M. 📂 Article 📅 2008 🏛 IEEE ⚖ 423 KB

[IEEE 2008 15th International Symposium

[IEEE 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits - singapore (2008.07.7-2008.07.11)] 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits - A novel pseudo tri-gate vertical MOSFET with source/drain tie

✍ Jyi-Tsong Lin, ; Ying-Chieh Tsai, ; Yi-Chuen Eng, ; Shiang-Shi Kang, ; Yi-Ming T 📂 Article 📅 2008 🏛 IEEE ⚖ 1015 KB

[IEEE 2008 15th International Symposium

[IEEE 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits - singapore (2008.07.7-2008.07.11)] 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Studies and applications of standardless EDX quantification method in failure analysis of wafer fabrication

✍ Hua Younan, ; Liu Binghai, ; Mo Zhiqiang, ; Teong, Jennifer 📂 Article 📅 2008 🏛 IEEE ⚖ 524 KB

[IEEE 2012 19th IEEE International Sympo

[IEEE 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2012) - Singapore, Singapore (2012.07.2-2012.07.6)] 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Ultrafast submicron thermal characterization of integrated circuits

✍ Shakouri, Ali; Maize, Kerry; Jackson, Philip; Wang, Xi; Vermeersch, Bjorn; Yazaw 📂 Article 📅 2012 🏛 IEEE ⚖ 302 KB

[IEEE 2010 17th IEEE International Sympo

[IEEE 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2010) - Singapore, Singapore (2010.07.5-2010.07.9)] 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Reliability and failure analysis in designing a typical operation amplifier

✍ Chang, W. L.; Luo, J. Y.; Qi, Y.; Wang, B. 📂 Article 📅 2010 🏛 IEEE ⚖ 229 KB

[IEEE 2012 19th IEEE International Sympo

[IEEE 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2012) - Singapore, Singapore (2012.07.2-2012.07.6)] 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Copper oxidation study by TEM

✍ Esa, Siti Rahmah; Yahya, Rosiyah; Hassan, Aziz; Omar, Ghazali 📂 Article 📅 2012 🏛 IEEE ⚖ 65 KB