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[IEEE 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (I-THERM) - Orlando, FL, USA (2008.05.28-2008.05.31)] 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - CFD modeling of a thermoelectric device for electronics cooling applications

✍ Scribed by Lakhkar, Nikhil; Hossain, Mohammad; Agonafer, Dereje

Book ID: 115485695
Publisher: IEEE
Year: 2008
Tongue: English
Weight: 285 KB
Volume: 0
Category: Article
ISBN: 1424417007
DOI: 10.1109/itherm.2008.4544360

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