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[IEEE InterSociety Conference on Thermal Phenomena in Electronic Systems, I-THERM V - Orlando, FL, USA (29 May-1 June 1996)] InterSociety Conference on Thermal Phenomena in Electronic Systems, I-THERM V - Numerical and experimental evaluation of planar and staggered heat sinks

✍ Scribed by Sathyamurthy, P.; Runstadler, P.W.; Lee, S.

Book ID: 118026859
Publisher: IEEE
Year: 1996
Weight: 667 KB
Volume: 0
Category: Article
ISBN-13: 9780780333253
DOI: 10.1109/itherm.1996.534554

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