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[IEEE The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems - Las Vegas, NV, USA (1-4 June 2004)] The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) - CFD simulation of thermal dissipation from fan-added plate fin and offset strip fin heat sinks

✍ Scribed by Won Nyun Kim, ; Seo Young Kim, ; Byung Ha Kang,

Book ID: 118026863
Publisher: IEEE
Year: 2004
Weight: 358 KB
Volume: 0
Category: Article
ISBN-13: 9780780383579
DOI: 10.1109/itherm.2004.1319176

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