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[IEEE 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (I-THERM) - Orlando, FL, USA (2008.05.28-2008.05.31)] 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Fluid-to-fluid spot-to-spreader (F2/S2) hybrid heat sink for integrated chip-level and hotspot-level thermal management

โœ Scribed by Green, Craig; Fedorov, Andrei G.; Joshi, Yogendra K.


Book ID
118029733
Publisher
IEEE
Year
2008
Tongue
English
Weight
1011 KB
Volume
0
Category
Article
ISBN
1424417007

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