[IEEE 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (I-THERM) - Orlando, FL, USA (2008.05.28-2008.05.31)] 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Fluid-to-fluid spot-to-spreader (F2/S2) hybrid heat sink for integrated chip-level and hotspot-level thermal management

✍ Scribed by Green, Craig; Fedorov, Andrei G.; Joshi, Yogendra K.

• Book ID: 118029733
• Publisher: IEEE
• Year: 2008
• Tongue: English
• Weight: 1011 KB
• Volume: 0
• Category: Article
• ISBN: 1424417007
• DOI: 10.1109/itherm.2008.4544311