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[IEEE 2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. - San Jose, CA, USA (April 17-21, 2005)] 2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. - Stress migration and the mechanical properties of copper

✍ Scribed by Alers, G.B.; Sukamto, J.; Woytowitz, P.; Lu, X.; Kailasam, S.; Reid, J.

Book ID: 126642449
Publisher: IEEE
Year: 2005
Tongue: English
Weight: 884 KB
Edition: 2005
Category: Article
ISBN-13: 9780780388031
DOI: 10.1109/RELPHY.2005.1493058

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