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High-temperature reliability of Flip Chip assemblies

✍ Scribed by T. Braun; K.-F. Becker; M. Koch; V. Bader; R. Aschenbrenner; H. Reichl

Publisher: Elsevier Science
Year: 2006
Tongue: English
Weight: 566 KB
Volume: 46
Category: Article
ISSN: 0026-2714
DOI: 10.1016/j.microrel.2005.06.004

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