✦ LIBER ✦
Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package
✍ Scribed by Yue Ying Ong; Soon Wee Ho; Kripesh Vaidyanathan; Vasarla Nagendra Sekhar; Ming Chinq Jong; Samuel Lim Yak Long; Vincent Lee Wen Sheng; Leong Ching Wai; Vempati Srinivasa Rao; Jimmy Ong; Xuefen Ong; Xiaowu Zhang; Yoon Uk Seung; John H. Lau; Yeow Kheng Lim; David Yeo; Kai Chong Chan; Zhang Yanfeng; Juan Boon Tan; Dong Kyun Sohn
- Publisher
- Elsevier Science
- Year
- 2010
- Tongue
- English
- Weight
- 805 KB
- Volume
- 50
- Category
- Article
- ISSN
- 0026-2714
No coin nor oath required. For personal study only.