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Junction temperature and reliability of high-power flip-chip light emitting diodes

✍ Scribed by Z.Z. Chen; P. Liu; S.L. Qi; L. Lin; H.P. Pan; Z.X. Qin; T.J. Yu; Z.K. He; G.Y. Zhang

Publisher: Elsevier Science
Year: 2007
Tongue: English
Weight: 470 KB
Volume: 10
Category: Article
ISSN: 1369-8001
DOI: 10.1016/j.mssp.2007.11.007

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