Fabrication and thermal analysis of flip-chip light-emitting diodes with different numbers of Au stub bumps

✍ Scribed by Cheng-Chen Lin; Liann-Be Chang; Ming-Jer Jeng; Chia-Yi Yen; Atanu Das; Chung-Yi Tang; Ming-Yi Tsai; Mu-Jen Lai

• Publisher: Elsevier Science
• Year: 2010
• Tongue: English
• Weight: 925 KB
• Volume: 50
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/j.microrel.2010.01.036