Electrical and thermal stability of Ag ohmic contacts for GaN-based flip-chip light-emitting diodes by using an AgAl alloy capping layer

✍ Scribed by Yoon Tae Hwang; Hyun-Gi Hong; Tae-Yeon Seong; D.-S. Leem; T. Lee; K.-K. Kim; J.-O. Song

• Publisher: Elsevier Science
• Year: 2007
• Tongue: English
• Weight: 582 KB
• Volume: 10
• Category: Article
• ISSN: 1369-8001
• DOI: 10.1016/j.mssp.2007.01.001