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Optimization of board-level thermomechanical reliability of high performance flip-chip package assembly

✍ Scribed by Tong Hong Wang; Ching-Chun Wang; Yi-Shao Lai; Kuo-Chin Chang; Chien-Hsun Lee

Publisher
Elsevier Science
Year
2008
Tongue
English
Weight
559 KB
Volume
85
Category
Article
ISSN
0167-9317

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✍ Tong Hong Wang; Chang-Chi Lee; Yi-Shao Lai πŸ“‚ Article πŸ“… 2010 πŸ› Elsevier Science 🌐 English βš– 970 KB

Thermal analysis was performed in this work to compare the thermal performance of a board-level high performance flip-chip ball grid array package equipped with solid Cu or vapor chamber (VC) as the heat spreader and Al-filler gel or In solder as the thermal interface material (TIM). The effect of d