Optimal design towards enhancement of board-level thermomechanical reliability of wafer-level chip-scale packages

✍ Scribed by Yi-Shao Lai; Tong Hong Wang

• Publisher: Elsevier Science
• Year: 2007
• Tongue: English
• Weight: 434 KB
• Volume: 47
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/j.microrel.2006.04.008