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High-temperature creep and hardness of eutectic 80Au/20Sn solder

โœ Scribed by Y.C. Liu; J.W.R. Teo; S.K. Tung; K.H. Lam


Book ID
116601873
Publisher
Elsevier Science
Year
2008
Tongue
English
Weight
509 KB
Volume
448
Category
Article
ISSN
0925-8388

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