Investigation of interfacial reaction and joint reliability between eutectic Sn–3.5Ag solder and ENIG-plated Cu substrate during high temperature storage test

✍ Scribed by Jeong-Won Yoon; Hyun-Suk Chun; Seung-Boo Jung

• Publisher: Springer US
• Year: 2006
• Tongue: English
• Weight: 673 KB
• Volume: 18
• Category: Article
• ISSN: 0957-4522
• DOI: 10.1007/s10854-006-9085-4