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Creep behavior of eutectic 80Au/20Sn solder alloy

โœ Scribed by G.S. Zhang; H.Y. Jing; L.Y. Xu; J. Wei; Y.D. Han


Book ID
116604186
Publisher
Elsevier Science
Year
2009
Tongue
English
Weight
297 KB
Volume
476
Category
Article
ISSN
0925-8388

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