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High heat flux cooling for silicon hybrid multichip packaging

✍ Scribed by Jaeger, R.C.; Goodling, J.S.; Baginski, M.E.; Ellis, C.D.; Williamson, N.V.; O'Barr, R.M.


Book ID
117872675
Publisher
IEEE
Year
1989
Tongue
English
Weight
778 KB
Volume
12
Category
Article
ISSN
0148-6411

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