High heat flux cooling for silicon hybrid multichip packaging : Richard C. Jaeger, John S. Goodling, Michael E. Baginski, Charles D. Ellis, N. Vincent Williamson and R. Mark O'Barr. IEEE Trans. Compon. Hybrids mfg Technol.12(4), 772 (1989)

• Book ID: 103284799
• Publisher: Elsevier Science
• Year: 1990
• Tongue: English
• Weight: 132 KB
• Volume: 30
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(90)90375-w