Re-entrant cavity surface enhancements for immersion cooling of silicon multichip packages

✍ Scribed by Phadke, N.K.; Bhavnani, S.H.; Goyal, A.; Jaeger, R.C.; Goodling, J.S.

• Book ID: 114560377
• Publisher: IEEE
• Year: 1992
• Tongue: English
• Weight: 776 KB
• Volume: 15
• Category: Article
• ISSN: 0148-6411
• DOI: 10.1109/33.180047