✦ LIBER ✦
Re-entrant cavity surface enhancements for immersion cooling of silicon multichip packages : Narendra K. Phadke et al. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15(5), 815 (1992)
- Publisher
- Elsevier Science
- Year
- 1993
- Tongue
- English
- Weight
- 219 KB
- Volume
- 33
- Category
- Article
- ISSN
- 0026-2714
No coin nor oath required. For personal study only.