An experimental investigation on a novel high-performance integrated heat pipe–heat sink for high-flux chip cooling

✍ Scribed by X.L. Xie; Y.L. He; W.Q. Tao; H.W. Yang

• Publisher: Elsevier Science
• Year: 2008
• Tongue: English
• Weight: 700 KB
• Volume: 28
• Category: Article
• ISSN: 1359-4311
• DOI: 10.1016/j.applthermaleng.2007.05.010