𝔖 Bobbio Scriptorium

✦ LIBER ✦

5402004 Heat transfer module for ultra high density and silicon on silicon packaging applications

Book ID: 116176073
Publisher: Elsevier Science
Year: 1996
Tongue: English
Weight: 138 KB
Volume: 27
Category: Article
ISSN: 1359-835X
DOI: 10.1016/1359-835x(95)98822-s

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