Handbook of Wafer Bonding (RAMM:WAFER BONDING O-BK) || Microelectromechanical Systems
โ Scribed by Ramm, Peter; Lu, James Jian-Qiang; Taklo, Maaike M. V.
- Book ID
- 118265619
- Publisher
- Wiley-VCH Verlag GmbH & Co. KGaA
- Year
- 2012
- Weight
- 177 KB
- Category
- Article
- ISBN
- 3527326464
No coin nor oath required. For personal study only.
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