✦ LIBER ✦
Application of Au-Sn eutectic bonding in hermetic radio-frequency microelectromechanical system wafer level packaging
✍ Scribed by Qian Wang; Sung-Hoon Choa; Woonbae Kim; Junsik Hwang; Sukjin Ham; Changyoul Moon
- Book ID
- 110626663
- Publisher
- Springer US
- Year
- 2006
- Tongue
- English
- Weight
- 290 KB
- Volume
- 35
- Category
- Article
- ISSN
- 0361-5235
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