✦ LIBER ✦
Structural evaluation of silicon-on-insulator fabricated by a direct wafer bonding and numerically controlled polishing technique: A. Yamada, B. Jiang, G. A. Rozgonyi, H. Shirotori, O. Okabayashi, M. Kawashima, Journal of the Electrochemical Society, 138(8), pp. 2468–2474. (Aug 1991)
- Publisher
- Elsevier Science
- Year
- 1992
- Tongue
- English
- Weight
- 138 KB
- Volume
- 14
- Category
- Article
- ISSN
- 0141-6359
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