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Growth mechanism of Ni3Sn4 in a Sn/Ni liquid/solid interfacial reaction

โœ Scribed by J. Shen; Y.C. Chan; S.Y. Liu


Book ID
108049083
Publisher
Elsevier Science
Year
2009
Tongue
English
Weight
897 KB
Volume
57
Category
Article
ISSN
1359-6454

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The solid-state reactive diffusion between Ni and Sn was experimentally studied using Sn/Ni/Sn diffusion couples. The diffusion couples were prepared by a diffusion bonding technique and then annealed at temperatures between T = 433 and 473 K for various times in an oil bath with silicone oil. At th