Effect of Ni–P thickness on solid-state interfacial reactions between Sn–3.5Ag solder and electroless Ni–P metallization on Cu substrate

✍ Scribed by Aditya Kumar; Zhong Chen; S.G. Mhaisalkar; C.C. Wong; Poi Siong Teo; Vaidhyanathan Kripesh

• Book ID: 108289149
• Publisher: Elsevier Science
• Year: 2006
• Tongue: English
• Weight: 804 KB
• Volume: 504
• Category: Article
• ISSN: 0040-6090
• DOI: 10.1016/j.tsf.2005.09.059