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Fast Concurrent Growth of Ni3Sn4and Voids During Solid-State Reaction Between Sn-Rich Solder and Ni Substrates

โœ Scribed by Bo-Mook Chung; Jaeho Choi; Joo-Youl Huh


Book ID
107457365
Publisher
Springer US
Year
2011
Tongue
English
Weight
890 KB
Volume
41
Category
Article
ISSN
0361-5235

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Growth behavior of Ni3Sn4 layer during r
โœ M. Mita; M. Kajihara; N. Kurokawa; K. Sakamoto ๐Ÿ“‚ Article ๐Ÿ“… 2005 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 226 KB

The solid-state reactive diffusion between Ni and Sn was experimentally studied using Sn/Ni/Sn diffusion couples. The diffusion couples were prepared by a diffusion bonding technique and then annealed at temperatures between T = 433 and 473 K for various times in an oil bath with silicone oil. At th