✦ LIBER ✦

Growth kinetics of Ni3Sn4 and Ni3P layer between Sn–3.5Ag solder and electroless Ni–P substrate

✍ Scribed by Jeong-Won Yoon; Seung-Boo Jung

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Effect of Ni–P thickness on solid-state

✍ Aditya Kumar; Zhong Chen; S.G. Mhaisalkar; C.C. Wong; Poi Siong Teo; Vaidhyanath 📂 Article 📅 2006 🏛 Elsevier Science 🌐 English ⚖ 804 KB

Characterization of ternary Ni2SnP layer

✍ Han-Byul Kang; Jee-Hwan Bae; Jeong-Won Yoon; Seung-Boo Jung; Jongwoo Park; Cheol 📂 Article 📅 2010 🏛 Elsevier Science 🌐 English ⚖ 416 KB

Morphology and kinetic study of the inte

✍ Zhong Chen; Min He; Guojun Qi 📂 Article 📅 2004 🏛 Springer US 🌐 English ⚖ 990 KB

Retarding growth of Ni3P crystalline lay

✍ S.J. Wang; C.Y. Liu 📂 Article 📅 2003 🏛 Elsevier Science 🌐 English ⚖ 426 KB

Characterization of Interfacial Reaction

✍ Han-Byul Kang; Jee-Hwan Bae; Jae-Wook Lee; Min-Ho Park; Jeong-Won Yoon; Seung-Bo 📂 Article 📅 2007 🏛 Springer US 🌐 English ⚖ 373 KB

Fast Concurrent Growth of Ni3Sn4and Void

✍ Bo-Mook Chung; Jaeho Choi; Joo-Youl Huh 📂 Article 📅 2011 🏛 Springer US 🌐 English ⚖ 890 KB