✦ LIBER ✦

Finite element modeling of thermal fatigue and damage of solder joints in a ceramic ball grid array package

✍ Scribed by Bor Zen Hong

Publisher: Springer US
Year: 1997
Tongue: English
Weight: 775 KB
Volume: 26
Category: Article
ISSN: 0361-5235
DOI: 10.1007/s11664-997-0256-8

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