✦ LIBER ✦
Quick assessment methodology for reliability of solder joints in ball grid array (BGA) assembly—Part I: Creep constitutive relation and fatigue model
✍ Scribed by Shi Xunqing; Wang Zhiping; John HL Pang; Zhang Xueren; Nie Jingxu
- Publisher
- The Chinese Society of Theoretical and Applied Mechanics; Institute of Mechanics, Chinese Academy of Sciences
- Year
- 2002
- Tongue
- English
- Weight
- 827 KB
- Volume
- 18
- Category
- Article
- ISSN
- 0567-7718
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