A dislocation model of shear fatigue damage and life prediction of SMT solder joints under thermal cycling : Jihuo Huang et al. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15 (4), 553 (1992)

• Publisher: Elsevier Science
• Year: 1993
• Tongue: English
• Weight: 113 KB
• Volume: 33
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(93)90369-a