A dislocation model of shear fatigue damage and life prediction of SMT solder joints under thermal cycles

✍ Scribed by J.H. Huang; Y.Y. Qian; Y.H. Jiang; Q.L. Wang

• Publisher: Elsevier Science
• Year: 1993
• Tongue: English
• Weight: 414 KB
• Volume: 33
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(93)90323-q