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Failure analysis of pad-height effects in the fine-pitch interconnection of the anisotropic conductive films

✍ Scribed by Chao-Ming Lin; Tzu-Chao Lin; Te-Hua Fang; Kuo-Sheng Chao

Book ID: 104057985
Publisher: Elsevier Science
Year: 2008
Tongue: English
Weight: 666 KB
Volume: 48
Category: Article
ISSN: 0026-2714
DOI: 10.1016/j.microrel.2008.03.014

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