𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Shanghai, China (30 June-3 July 2004)] Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Recent progress toward anisotropic conductive films in flat panel display and semiconductor packaging applications

✍ Scribed by Matsuda, K.; Watanabe, I.

Book ID: 126638265
Publisher: IEEE
Year: 2004
Tongue: English
Weight: 677 KB
Category: Article
ISBN-13: 9780780386204
DOI: 10.1109/HPD.2004.1346663

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE Proceedings of the Sixth IEEE CPMT

[IEEE Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Shanghai, China (30 June-3 July 2004)] Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Integrated MEMS technology

✍ Cai Ran, ; Xue Cai, ; Fu Jin, ; Hu Yu, 📂 Article 📅 2004 🏛 IEEE 🌐 English ⚖ 396 KB

[IEEE Proceedings of the Sixth IEEE CPMT

[IEEE Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Shanghai, China (30 June-3 July 2004)] Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Conductivity improvement of isotropically conductive adhesives

✍ Yi Li, ; Kyoung-sik Moon, ; Haiying Li, ; Wong, C.P. 📂 Article 📅 2004 🏛 IEEE 🌐 English ⚖ 545 KB

[IEEE Proceedings of the Sixth IEEE CPMT

[IEEE Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Shanghai, China (30 June-3 July 2004)] Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Design of a high performance microcontroller

✍ Hu Yue-li, ; Cao Jia-lin, ; Ran Feng, ; Liang Zhi-jian, 📂 Article 📅 2004 🏛 IEEE 🌐 English ⚖ 407 KB

[IEEE Proceedings of the Sixth IEEE CPMT

[IEEE Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Shanghai, China (30 June-3 July 2004)] Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Microsystem manufacturing, assembly and packaging technology in Display-Card/spl trade/ applications

✍ Duan, J.; Asplund, J.; Liu, J. 📂 Article 📅 2004 🏛 IEEE ⚖ 509 KB

[IEEE Proceedings of the Sixth IEEE CPMT

[IEEE Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Shanghai, China (30 June-3 July 2004)] Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Next generation packaging technology for high performance ASICs

✍ Brillhart, M.; Jie Xue, 📂 Article 📅 2004 🏛 IEEE 🌐 English ⚖ 360 KB

[IEEE Proceedings of the Sixth IEEE CPMT

[IEEE Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Shanghai, China (30 June-3 July 2004)] Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Packaging influence on acceleration sensitivity of pyroelectric infrared detectors

✍ Gerlach, G.; Shvedov, D.; Norkus, V. 📂 Article 📅 2004 🏛 IEEE 🌐 English ⚖ 578 KB