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Study of the Formation of Bubbles in Rigid Substrate-Flexible Substrate Bonding Using Anisotropic Conductive Films and the Bubble Effects on Anisotropic Conductive Film Joint Reliability

✍ Scribed by Hyoung-Joon Kim; Chang-Kyu Chung; Yong-Min Kwon; Myung-Jin Yim; Soon-Min Hong; Se-Young Jang; Young-Joon Moon; Kyung-Wook Paik

Book ID: 107453533
Publisher: Springer US
Year: 2007
Tongue: English
Weight: 643 KB
Volume: 36
Category: Article
ISSN: 0361-5235
DOI: 10.1007/s11664-006-0015-2

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